uv glue
Ditai UV Adhesive: As a leading enterprise in the domestic UV curing adhesive industry, Ditai has always been committed to innovative research and industrial application of UV curing technology. The series of UV adhesive products independently developed by it have been successfully applied in high-end manufacturing fields such as consumer electronics, precision instruments, and optical devices, especially in the process of fully bonding mobile phone touch modules, LCD display panel packaging, precision assembly of micro motors, and enhanced fixation of FPC wiring, demonstrating excellent performance. Based on a deep understanding of industry demand, Ditai has taken the lead in breaking through the limitations of single curing technology and innovatively developed a dual curing composite system solution. Through the synergistic effect of light curing and moisture curing/anaerobic curing, we have successfully overcome the technical bottleneck of traditional UV adhesives that are difficult to fully cure in shaded areas, providing a more reliable process guarantee for precision bonding of complex three-dimensional structures. And successfully applied to key processes in emerging fields such as 5G communication equipment and new energy vehicle electronics.
Product Type | colour | Viscosity(CPS) | temperature resistance(°C) | green strength | Apply Recommendations |
53465 | blue | 15000 | -54∽120 | tall | UV curing, heat curing, and accelerator assisted multiple curing technologies are suitable for high-strength bonding of metal and glass substrates, and can be widely used in precision packaging processes such as electronic component encapsulation and circuit jumper fixation |
5301 | Transparent, colorless | 300 | -54∽150 | tall | Widely used for needle bonding and oxygen mask bonding |
5311 | Transparent, colorless | 5500 | -54∽150 | super high | Suitable for strong bonding of stress sensitive plastics, PC, PVC |
53468 | milky white | 40000 | -54∽150 | tall | High strength, high hardness, low shrinkage, resistance to high temperature, high humidity, and thermal shock; Suitable for bonding PD/LD diodes on laser heads and pre fixing copper parts on laser modules |
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