Ditai has taken the lead in breaking through the limitations of single curing technology and innovatively developed a dual curing composite system solution.
Ditai UV Adhesive: As a leading enterprise in the domestic UV curing adhesive industry, Ditai has always been committed to innovative research and industrial application of UV curing technology. The series of UV adhesive products independently developed by it have been successfully applied in high-end manufacturing fields such as consumer electronics, precision instruments, and optical devices, especially in the process of fully bonding mobile phone touch modules, LCD display panel packaging, precision assembly of micro motors, and enhanced fixation of FPC wiring, demonstrating excellent performance.
Ditai UV Adhesive: As a leading enterprise in the domestic UV curing adhesive industry, Ditai has always been committed to innovative research and industrial application of UV curing technology.
Ditai UV Adhesive: As a leading enterprise in the domestic UV curing adhesive industry, Ditai has always been committed to innovative research and industrial application of UV curing technology. The series of UV adhesive products independently developed by it have been successfully applied in high-end manufacturing fields such as consumer electronics, precision instruments, and optical devices, especially in the process of fully bonding mobile phone touch modules, LCD display panel packaging, precision assembly of micro motors, and enhanced fixation of FPC wiring, demonstrating excellent performance.
Two component acrylic structural adhesive is a versatile methyl acrylic structural adhesive suitable for assembling and bonding metal shells.
Two component acrylic resin adhesive can achieve high strength in a short period of time and greatly improve production efficiency. This series of products has strong impact resistance and good bonding strength on various substrates, suitable for bonding metal and plastic parts in electronic products. Can be used for manual and automatic assembly lines, suitable for assembling components with thinner adhesive layers in the electronics industry.
The curing process of PUR hot melt adhesive (reactive polyurethane hot melt adhesive) has unique dual characteristics.
The curing process of PUR hot melt adhesive (reactive polyurethane hot melt adhesive) has unique dual characteristics. In its initial curing stage, a bonding interface is formed through physical solidification, and then a chemical cross-linking reaction is triggered by contact with moisture in the environment, which releases trace amounts of carbon dioxide into the atmosphere. With the increase of crosslinking degree, the adhesive layer gradually forms a polymer with a three-dimensional network structure, endowing the material with excellent cohesive strength and interface stability.